Characteristics:
High Reliability
Low Insertion
RoHS Compliant
Low Temperature Correlation
Application:
Data Center and QSFP Modules
Product Type & Dimension:
Fig.1 MUX with LC Stub and Receptacle

Fig.2 Demux with LC Receptacle

Note: fiber length, fiber type, LC stub and receptacle can be customized.
Parameter:
Item | Condition/ Measure Method | Symbol | Unit | Type |
Mux | Demux |
Channel |
| CH |
| 4 |
Spacing |
| Space | nm | 20 |
CWL | 25℃@3dB Center | λC | nm | CH1:1271 |
CH2:1291 |
CH3:1311 |
CH4:1331 |
CWL Accuracy | 25℃@3dB Center | △λC | nm | ±1 |
1dB Bandwidth |
| BW1dB | nm | ≥12 | ≥12 |
3dB Bandwidth |
| BW3dB | nm | ≥15 | ≥15 |
Channel Uniformity | All channel ILmax-ILmin | Unit 1 | dB | ≤0.7 |
Chip Uniformity | All chip ILmax-ILmin | Unit 2 | dB | ≤2 | / |
Insertion Loss | @Passband±5nm;Including PDL and fiber coupling | IL | dB | 2~3.5 | ≤2.5 |
Polarization Dependent Loss | Passband±1nm | PDL | dB | ≤0.5 |
Ripple | Passband±5nm | R | dB | ≤1.0 |
Return Loss |
| RL | dB | ≥40 |
Isolation(Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
Isolation(Non-Adjacent) | Passband±6.5nm | Iso | dB | / | ≥20 |
Polarization Mode Dispersion |
| PMD | PS | ≤0.15 | ≤0.15 |
Temperature Dependent Loss | -50~+85℃ | TDL | dB | ≤0.2 | ≤0.2 |
Wavelength thermal stability |
| WTS | Nm/℃ | ≤0.012 | / |
Channel Pitch |
|
| Um | 500 | 250 |
Input/ Output Side |
|
|
| Identical Side | Opposite Side |
Chip Size | Max Size |
| mm | ≤7.6*4.0 | ≤10.2*1.6 |
Chip Height |
|
| mm | ≤1.3 | ≤1.0 |
Operating Temperature |
|
| ℃ | -5~+80 |
Storage Temperature |
|
| ℃ | -40~+85 |